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IEC 61189-3/AMD1/FRAG7 ED1

Test methods for interconnection structures (printed boards) - Test N05: Thermal shock, floating, solder bath 280°C

General information

30.97   End of interruption of work - split/merged   Jul 7, 1995

IEC

TC 91

International Standard

Life cycle

NOW

ABANDON
IEC 61189-3/AMD1/FRAG7 ED1
30.97 End of interruption of work - split/merged
Jul 7, 1995

REVISED BY

PUBLISHED
IEC 61189-3:2007 ED2