IEC 61189-3-303 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards

General information

30.99   CD approved for registration as DIS   Jan 30, 2026

TCDV    Mar 27, 2026

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Life cycle

NOW

IN_DEVELOPMENT
IEC 61189-3-303 ED1
30.99 CD approved for registration as DIS
Jan 30, 2026