IEC 61189-3:1997+AMD1:1999 CSV ED1.1

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) IEC 61189-3:1997+AMD1:1999 CSV ED1.1

Scope

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods.

This consolidated version consists of the first edition (1997)
and its amendment 1 (1999). Therefore, no need to order amendment in
addition to this publication.