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IEC 61189-2-809:2024 ED1

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA IEC 61189-2-809:2024 ED1

Publication date:   Dec 9, 2024

General information

60.60   Standard published   Dec 9, 2024

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA).
This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.

Life cycle

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PUBLISHED
IEC 61189-2-809:2024 ED1
60.60 Standard published
Dec 9, 2024




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