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IEC 61189-2-801:2023 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

Publication date:   Jul 26, 2023

General information

60.60   Standard published   Jul 26, 2023

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61189-2-801:2023 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.

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PUBLISHED
IEC 61189-2-801:2023 ED1
60.60 Standard published
Jul 26, 2023