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IEC 61189-2-629 ED1

Test method of adhesion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application

General information

10.98   New project rejected   Oct 11, 2013

IEC

TC 91

International Standard

Life cycle

NOW

ABANDON
IEC 61189-2-629 ED1
10.98 New project rejected
Oct 11, 2013