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IEC 61189-2-629 ED1

Test method of adhesion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application IEC 61189-2-629 ED1

General information

10.98   New project rejected   Oct 11, 2013

IEC

TC 91

International Standard

Life cycle

NOW

ABANDON
IEC 61189-2-629 ED1
10.98 New project rejected
Oct 11, 2013




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