IEC 61188-1-2:1998 ED1

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

Publication date:   Apr 29, 1998

95.99   Withdrawal of Standard   Sep 25, 2020

General information

95.99   Withdrawal of Standard   Sep 25, 2020

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.

Life cycle

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IEC 61188-1-2:1998 ED1
95.99 Withdrawal of Standard
Sep 25, 2020