Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
ABANDON
IEC 60749-21/FRAGF ED1
30.97
End of interruption of work - split/merged
Oct 17, 2005
WITHDRAWN
IEC 60749-21:2011 ED2
