IEC 60748-23-2:2002 ED1

Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests IEC 60748-23-2:2002 ED1

Publication date:   May 23, 2002

General information

60.60 Standard published   May 23, 2002

IEC

TC 47/SC 47A

International Standard

31.200   Integrated circuits. Microelectronics

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Scope

Applies to high quality approval systems for hybrid integrated circuits and film structures.
The purpose of the tests is to perform visual inspections on the internal materials, construction and workmanship of hybrid, multichip and multichip module microcircuits and passive elements used for microelectronic applications including r.f./microwave.
These tests will normally be used on microelectronic devices prior to capping or encapsulation to detect and eliminate devices with internal non-conformances that could lead to device failure in normal application. They may also be employed on a sampling basis to determine the effectiveness of the manufacturers' quality control and handling procedures.

Life cycle

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PUBLISHED
IEC 60748-23-2:2002 ED1
60.60 Standard published
May 23, 2002