IEC 60691:1993+AMD1:1995+AMD2:2000 CSV ED2.2

Thermal-links - Requirements and application guide IEC 60691:1993+AMD1:1995+AMD2:2000 CSV ED2.2

General information

Current stage: 99.60 Withdrawal effective Dec 19, 2002

Originator: IEC

Owner: TC 32/SC 32C Miniature fuses

Type: International Standard

ICS: 29.120.50 Fuses and other overcurrent protection devices

Scope

Applies to thermal-links, intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions.
May be applicable to thermal-links for use under other than indoor conditions, provided that the climatic and other circum-
stances in the immediate surroundings of such thermal-links are comparable with those in this standard.

Life cycle

NOW

WITHDRAWN
IEC 60691:1993+AMD1:1995+AMD2:2000 CSV ED2.2
99.60 Withdrawal effective
Dec 19, 2002

REVISED BY

WITHDRAWN
IEC 60691:2002 ED3