IEC 60684-3-281:2010 gives the requirements for two types of heat-shrinkable, polyolefin sleeving, semiconductive, with a nominal shrink ratio of 3:1. This sleeving has been found suitable up to temperatures of 100 °C.
- Type A: Thin wall - Internal diameter up to 195,0 mm typically;
- Type B: Medium wall - Internal diameter up to 120,0 mm typically
WITHDRAWN
IEC 60684-3-281:2010 ED1
99.60
Withdrawal effective
Jun 2, 2025
PUBLISHED
IEC 60684-3-281:2025 ED2