Revised
IEC 60539-2:2003 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.
WITHDRAWN
IEC 60539-2:2003 ED1
99.60
Withdrawal effective
Jul 19, 2019
WITHDRAWN
IEC 60539-2:2003/AMD1:2010 ED1
PUBLISHED
IEC 60539-2:2019 ED2