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IEC 60326-11:1991 ED1

Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections IEC 60326-11:1991 ED1

Publication date:   Mar 19, 1991

95.99   Withdrawal of Standard   Oct 15, 2004

General information

95.99   Withdrawal of Standard   Oct 15, 2004

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Buying

Withdrawn

Language in which you want to receive the document.

Scope

Relates to flex-rigid multilayer printed boards with through connections irrespective of their method of manufacture. Intended as a basis on which agreements between purchaser and vendor can be made. Defines the characteristics to be assessed, the test methods to be used, and establishes uniform requirements for judging properties and dimensions.
Not applicable to flat cables.

Life cycle

NOW

WITHDRAWN
IEC 60326-11:1991 ED1
95.99 Withdrawal of Standard
Oct 15, 2004

REVISED BY

ABANDON
IEC 60326-11 ED2




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