Specifies the general requirements of enamelled round copper winding wires with or without bonding layer. This publication supersedes IEC 60182-1 (1984) and IEC 60182-2 (1987).
WITHDRAWN
IEC 60317-0-1:1997+AMD1:1999 CSV ED2.1
99.60
Withdrawal effective
Nov 21, 2005
WITHDRAWN
IEC 60317-0-1:2008 ED3