IEC 60249-3-3:1991 ED1

Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards IEC 60249-3-3:1991 ED1

Publication date:   Jun 4, 1991

95.99 Withdrawal of Standard   Oct 15, 2004

General information

95.99 Withdrawal of Standard   Oct 15, 2004

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

Gives the test methods, conditions, and requirements for solder resist material as manufactured and for a solder resist system which comprises the material, the application process, and a printed board.
Solder resist for the uses considered in this specification may be of two types, as specified by the purchaser.
Provides three classes of requirements to reflect progressive increases in sophistication, functional performance requirements and testing severity.

Life cycle

NOW

WITHDRAWN
IEC 60249-3-3:1991 ED1
95.99 Withdrawal of Standard
Oct 15, 2004

REVISED BY

ABANDON
IEC 60249-3-3 ED2