IEC 60249-3-1:1981 ED2

Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards IEC 60249-3-1:1981 ED2

Publication date:   Jan 1, 1981

95.99 Withdrawal of Standard   Oct 15, 2004

General information

95.99 Withdrawal of Standard   Oct 15, 2004

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Buying

Withdrawn

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Scope

Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.

Life cycle

NOW

WITHDRAWN
IEC 60249-3-1:1981 ED2
95.99 Withdrawal of Standard
Oct 15, 2004

REVISED BY

ABANDON
IEC 60249-3-1 ED3