IEC 60249-2C:1973 ED1

Third supplement - Metal-clad base materials for printed circuits - Part 2: Specifications

Publication date:   Jan 1, 1973

General information

99.60 Withdrawal effective   Nov 19, 2016

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Life cycle

NOW

WITHDRAWN
IEC 60249-2C:1973 ED1
99.60 Withdrawal effective
Nov 19, 2016

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60249-2C:1973/AMD1:1978 ED1

WITHDRAWN
IEC 60249-2C:1973/AMD2:1979 ED1

REVISED BY

WITHDRAWN
IEC 60249-2-11:1987 ED1