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IEC 60249-2-19:1992 ED1

Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Publication date:   Mar 31, 1992

95.99   Withdrawal of Standard   Oct 15, 2004

General information

95.99   Withdrawal of Standard   Oct 15, 2004

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

Gives requirements for properties of thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards.
Laminated sheets covered by this specification have thicknesses (copper foil not included) not greater than 0,8 mm (0.031 in).

Life cycle

NOW

WITHDRAWN
IEC 60249-2-19:1992 ED1
95.99 Withdrawal of Standard
Oct 15, 2004

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60249-2-19:1992/AMD1:1993 ED1

WITHDRAWN
IEC 60249-2-19:1992/AMD2:1994 ED1

REVISED BY

WITHDRAWN
IEC 61249-2-19:2001 ED1