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IEC 60191-6-14 ED1

Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) IEC 60191-6-14 ED1

General information

10.98   New project rejected   Jun 29, 2007

IEC

TC 47/SC 47D

International Standard

Life cycle

NOW

ABANDON
IEC 60191-6-14 ED1
10.98 New project rejected
Jun 29, 2007




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