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HD 313.2.13 S1:1989

Base materials for printed circuits - Part 2: Specifications - Specification No. 13: Flexible copper-clad polyimide film, general purpose grade HD 313.2.13 S1:1989

General information

99.60   Withdrawal effective   Jan 8, 1994

CENELEC

CLC/SR 91 Electronics assembly technology

Harmonization Document

Scope

This specification gives requirements for properties of flexible copper-clad polyimide film general purpose grade (To designate this material the reference 249-2-13-IEC-PI-Cu may be used if there is no risk of confusion the type designation may be abbreviated to read IEC-249-2-13) - The specification includes optional requirements which apply only by agreement between purchaser and supplier - Copper-clad film complying with all the requirements not marked "optional" should bedeemed to comply with this specification

Life cycle

NOW

WITHDRAWN
HD 313.2.13 S1:1989
99.60 Withdrawal effective
Jan 8, 1994

REVISED BY

WITHDRAWN
EN 60249-2-13:1994

Relations

Adopted from IEC 60249-2-13:1987 IDENTICAL




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