HD 313.2.11 S1:1989

Base materials for printed circuits - Part 2: Specifications - Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards

General information

99.60   Withdrawal effective   Sep 15, 1991

CENELEC

CLC/SR 91 Electronics assembly technology

Harmonization Document

Scope

This specification gives requirements for properties of thin epoxide woven glass fabric copper-clad laminated sheet general purpose grade for use in the fabrication of multilayer printed boards - Laminated sheets covered by this specification have thicknesses (of the base laminate excluding the copper foil) not greater than 0.8 mm (0.031 in) - Although primarily intended for multilayer boards the materials may be used for single-sided or double-sided printed boards

Life cycle

NOW

WITHDRAWN
HD 313.2.11 S1:1989
99.60 Withdrawal effective
Sep 15, 1991

REVISED BY

WITHDRAWN
HD 313.2.11 S2:1990

Relations

Adopted from IEC 60249-2-11:1987 IDENTICAL