HD 313.1 S4:1987

Base materials for printed circuits - Part 1: Test methods HD 313.1 S4:1987

General information

99.60   Withdrawal effective   Mar 1, 1992

CENELEC

CLC/SR 91 Electronics assembly technology

Harmonization Document

Scope

This standard describes methods for testing electrical, mechanical and other properties of base materials in sheet or roll form for application in field of printed circuits irrespective of the nature of the insulating base material - Those methods which are specific to the testing of the materials given in IEC Publication 249-3: Base Materials for Printed Circuits - Part 3: Special Materials Used in connection with Printed Circuits are contained in Part 3 and are not included in this part of the publication - The methods described for the preparation of test specimens from metal-clad materials are complete for copper-clad materials only - They may be expanded in future to include materials clad with other metals - The number of specimens stated to measure each property is the number required to produce a test result of sufficient precision to evaluate a single sample of material - For purposes of qualification approval, this number of specimens should be taken from each sheet tested - For purposes of continuous assessment of quality, the number of specimens taken from each sheet (sample) tested depends on the quality assurance system used and on its sampling plans

Life cycle

NOW

WITHDRAWN
HD 313.1 S4:1987
99.60 Withdrawal effective
Mar 1, 1992

REVISED BY

WITHDRAWN
HD 313.1 S5:1991




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