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FprEN IEC 61189-3-720:2026

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards FprEN IEC 61189-3-720:2026

Publication date:   Jul 3, 2026

General information

50.60   Close of voting. Proof returned by secretariat   Aug 14, 2026

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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FprEN IEC 61189-3-720:2026
50.60 Close of voting. Proof returned by secretariat
Aug 14, 2026




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