FprEN 62047-27:2015

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) FprEN 62047-27:2015

General information

50.98 Project deleted   Dec 14, 2016

CENELEC

CLC/SR 47F Micro-electromechanical systems

European Norm

Scope

IEC 62047-27:2017(E) specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries.

The micro-chevron-test is an experimental method to determine the fracture toughness <em>K</em>IC of brittle materials or bond interfaces using specifically designed test chips (micro-chevron-samples) under defined load conditions (crack opening mode I). Owing to its high precision and low variance, it is suitable for analysing the influence of different process parameters on bond strength as well as for quality assurance.

Life cycle

NOW

ABANDON
FprEN 62047-27:2015
50.98 Project deleted
Dec 14, 2016