FprEN 61189-3-913:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs FprEN 61189-3-913:2015

General information

50.98   Project deleted   Jun 24, 2019

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

Scope

IEC 61189-3-913:2016 specifies the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs. The test applies to printed circuit boards for high-brightness LEDs with surface mounted LEDs or with device embedded LEDs in electronic control devices (ECDs).
This first edition cancels and replaces the first edition of IEC PAS 61189-3-913 published in 2011. This edition constitutes a technical revision. This edition focused only on the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs.

Life cycle

NOW

ABANDON
FprEN 61189-3-913:2015
50.98 Project deleted
Jun 24, 2019




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