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EN ISO 9453:2006

Soft solder alloys - Chemical compositions and forms (ISO 9453:2006)

Publication date:   Oct 30, 2009

General information

99.60 Withdrawal effective   Aug 6, 2014

CEN

CEN/TC 121 Welding and allied processes

European Norm

25.160.50   Brazing and soldering

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Scope

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:
tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
tin-antimony;
tin-bismuth;
tin-copper, with and without silver;
tin-indium, with and without silver and bismuth;
tin-silver, with and without copper and bismuth;
tin-zinc, with and without bismuth.
ISO 9453:2006 also includes an indication of the forms generally available.

Life cycle

PREVIOUSLY

WITHDRAWN
EN 29453:1993

NOW

WITHDRAWN
EN ISO 9453:2006
99.60 Withdrawal effective
Aug 6, 2014

REVISED BY

WITHDRAWN
EN ISO 9453:2014