EN IEC 63251:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

Publication date:   Mar 18, 2024

General information

60.60   Standard published   Dec 8, 2023

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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Scope

This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

Life cycle

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PUBLISHED
EN IEC 63251:2023
60.60 Standard published
Dec 8, 2023