EN IEC 62148-21:2019

Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

Publication date:   Sep 19, 2019

General information

99.60   Withdrawal effective   May 27, 2024

CENELEC

CLC/SR 86C Fibre optic systems and active devices

European Norm

33.180.20   Fibre optic interconnecting devices

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Scope

This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative.
The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.

Life cycle

NOW

WITHDRAWN
EN IEC 62148-21:2019
99.60 Withdrawal effective
May 27, 2024

REVISED BY

PUBLISHED
EN IEC 62148-21:2021