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EN IEC 61760-2:2021

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide EN IEC 61760-2:2021

Publication date:   Dec 16, 2021

General information

60.60 Standard published   Sep 3, 2021

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.240   Mechanical structures for electronic equipment

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Scope

This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this standard is to ensure that users of SMDs receive and store products tha can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".

Life cycle

PREVIOUSLY

PUBLISHED
EN 61760-2:2007

NOW

PUBLISHED
EN IEC 61760-2:2021
60.60 Standard published
Sep 3, 2021