EN 61189-2:1997

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Publication date:   Aug 10, 2006

General information

99.60 Withdrawal effective   Sep 1, 2009

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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Scope

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

Life cycle

NOW

WITHDRAWN
EN 61189-2:1997
99.60 Withdrawal effective
Sep 1, 2009

REVISED BY

PUBLISHED
EN 61189-2:2006