EN 61188-5-4:2007

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Publication date:   Mar 28, 2008

General information

60.60 Standard published   Nov 23, 2007

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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Scope

Provides the component and land pattern dimensions for small outline integrated circuits with 'J' leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

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PUBLISHED
EN 61188-5-4:2007
60.60 Standard published
Nov 23, 2007