EN 60249-2-19:1993

Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

General information

99.60   Withdrawal effective   Feb 1, 2006

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

Scope

Gives requirements for properties of thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards. Laminated sheets covered by this specification have thicknesses (copper foil not included) not greater than 0,8 mm (0.031 in).

Life cycle

NOW

WITHDRAWN
EN 60249-2-19:1993
99.60 Withdrawal effective
Feb 1, 2006

CORRIGENDA / AMENDMENTS

WITHDRAWN
EN 60249-2-19:1993/A1:1994

WITHDRAWN
EN 60249-2-19:1993/A2:1995

Relations

Adopted from IEC 60249-2-19:1992 IDENTICAL