EN 60249-2-11:1994

Base materials for printed circuits - Part 2: Specifications - Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards EN 60249-2-11:1994

General information

99.60   Withdrawal effective   Feb 1, 2006

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

Scope

Gives requirements for properties of thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards. Laminated sheets covered by this specification have thicknesses (of the base laminate, excluding the copper foil) not greater than 0.8 mm (0.031 in). The sheet consists of an insulating base (epoxide resin bonded woven glass fabric laminate) with metal foil bonded to one or both sides.

Life cycle

PREVIOUSLY

WITHDRAWN
HD 313.2.11 S2:1990

NOW

WITHDRAWN
EN 60249-2-11:1994
99.60 Withdrawal effective
Feb 1, 2006

CORRIGENDA / AMENDMENTS

WITHDRAWN
EN 60249-2-11:1994/A4:2000

WITHDRAWN
EN 60249-2-11:1994/A3:1995

WITHDRAWN
EN 60249-2-11:1994/A2:1994

Relations

Adopted from IEC 60249-2-11:1987 IDENTICAL

Adopted from IEC 60249-2-11:1987/A1:1989 IDENTICAL




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