This CWA defines requirements and recommendations for recycling and repair aspects for printed board assemblies (PBAs) and could provide the basis for the repair and recycling related section in a future digital product passport for PBAs. The document excludes the definition of an IT infrastructure and is orientated on the current developments of CEN/CLC-JTC 24 - DPP.
PUBLISHED
CWA 18311:2025
60.60
Standard published
Dec 3, 2025
