CLC/TS 50625-5:2017

Collection, logistics & Treatment requirements for WEEE - Part 5: Specification for the final treatment of WEEE fractions - Copper and precious metals CLC/TS 50625-5:2017

Publication date:   Dec 14, 2017

Scope

This Technical Specification addresses the processes regarding the recycling of copper and/or precious metals contained in WEEE and fractions of WEEE.
NOTE 1 For the treatment of WEEE EN 50625-1 applies.
This Technical Specification relates to the chemical and metallurgical processes used for the recycling of copper and/or precious metals contained in WEEE and fractions of WEEE, thereby differentiating it from manual/mechanical processing (see Annex A).
All chemical and metallurgical processes are included up and until the output materials will be used for their original purpose or for other purposes or will be finally disposed of.
NOTE 2 The main precious metals concerned are gold, silver, and palladium.
NOTE 3 The majority of the WEEE volumes that are processed by final treatment operators consists of fractions of WEEE (e.g. circuit boards) containing copper and/or precious metals, however there may be whole small WEEE that can be treated directly in final treatment (e.g. USB sticks).
NOTE 4 Chemical and metallurgical processes are processes in which a chemical reaction takes place for example: pyrolysis, smelting, refining, solvent extraction, ion exchange, leaching/dissolution in water acids or base, precipitation, cementation, pressure leaching. They differ from mechanical / physical processes such as sorting and separation based on physical properties (e.g. density, magnetism, colour) and size reduction processes such as shredding and grinding.
NOTE 5 In general, these final treatment facilities are covered by the IED 2010/75/EU, e.g. copper smelters or refiners.

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