CLC/TR 62453-502:2009

Field device tool (FDT) interface specification - Part 502: Communication implementation for common object model - IEC 61784 CPF 2

Publication date:   Dec 30, 2009

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CENELEC

CLC/TC 65X Industrial-process measurement, control and automation

Technical Report

25.040.40   Industrial process measurement and control | 35.100.05   Multilayer applications | 35.110   Networking

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Scope

IEC/TR 62453-502:2009(E) is a technical report and provides information for integrating the CIP technology into the COM based implementation of FDT interface specification (IEC/TR 62453-5). Communication Profile Family 2 (commonly known as CIP<sup>TM1</sup>) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, and IEC 61158-6-2, IEC 62026-3. The basic profiles CP 2/1 (ControlNet<sup>TM2</sup>), CP 2/2 (EtherNet/IP<sup>TM3</sup>), and CP 2/3 (DeviceNet<sup>TM1</sup>) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNet<sup>TM</sup>), also based on CIP<sup>TM</sup>, is defined in [13]. It neither contains the FDT specification nor modifies it.

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CLC/TR 62453-502:2009
99.60 Withdrawal effective
Mar 23, 2023