CEN/CLC/TR 17603-31-14:2021

Space Engineering - Thermal design handbook - Part 14: Cryogenic Cooling CEN/CLC/TR 17603-31-14:2021

Scope

In this Part 14 cooling methods below 100 K are described. These low temperature levels are mainly required by space borne electronic systems operating under very low noise conditions. Details on the materials used and safety factors are given.
The Thermal design handbook is published in 16 Parts
TR 17603-31-01 Part 1 Thermal design handbook – Part 1: View factors
TR 17603-31-01 Part 2 Thermal design handbook – Part 2: Holes, Grooves and Cavities
TR 17603-31-01 Part 3 Thermal design handbook – Part 3: Spacecraft Surface Temperature
TR 17603-31-01 Part 4 Thermal design handbook – Part 4: Conductive Heat Transfer
TR 17603-31-01 Part 5 Thermal design handbook – Part 5: Structural Materials: Metallic and Composite
TR 17603-31-01 Part 6 Thermal design handbook – Part 6: Thermal Control Surfaces
TR 17603-31-01 Part 7 Thermal design handbook – Part 7: Insulations
TR 17603-31-01 Part 8 Thermal design handbook – Part 8: Heat Pipes
TR 17603-31-01 Part 9 Thermal design handbook – Part 9: Radiators
TR 17603-31-01 Part 10 Thermal design handbook – Part 10: Phase – Change Capacitors
TR 17603-31-01 Part 11 Thermal design handbook – Part 11: Electrical Heating
TR 17603-31-01 Part 12 Thermal design handbook – Part 12: Louvers
TR 17603-31-01 Part 13 Thermal design handbook – Part 13: Fluid Loops
TR 17603-31-01 Part 14 Thermal design handbook – Part 14: Cryogenic Cooling
TR 17603-31-01 Part 15 Thermal design handbook – Part 15: Existing Satellites
TR 17603-31-01 Part 16 Thermal design handbook – Part 16: Thermal Protection System