IEC 61760-2:1998 ED1

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Publication date:   Feb 26, 1998

General information

99.60 Withdrawal effective   Apr 24, 2007

IEC

TC 91 Electronics assembly technology

International Standard

31.020   Electronic components in general

Buying

Revised

Language in which you want to receive the document.

Scope

Describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble free processing of surface mounting devices, both active and passive.

The object of this International Standard is to ensure that users of SMDs receive and store products that can be further processed without prejudice to quality and reliability.

Life cycle

NOW

WITHDRAWN
IEC 61760-2:1998 ED1
99.60 Withdrawal effective
Apr 24, 2007

REVISED BY

WITHDRAWN
IEC 61760-2:2007 ED2