IEC 61249-7-1:1995 ED1

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper

Publication date:   Apr 26, 1995

General information

60.60 Standard published   Apr 26, 1995

IEC

TC 91 Electronics assembly technology

International Standard

31.180   Printed circuits and boards

Buying

Published

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Scope

Covers copper-clad Invar material of nominal thickness from 0,1 mm to 2,4 mm supplied in rolls or produced in sheets.

Life cycle

NOW

PUBLISHED
IEC 61249-7-1:1995 ED1
60.60 Standard published
Apr 26, 1995