IEC 60691:1993 ED2

Thermal-links - Requirements and application guide IEC 60691:1993 ED2

Publication date:   Mar 31, 1993

General information

99.60 Withdrawal effective   Dec 19, 2002

IEC

TC 32/SC 32C

International Standard

29.120.50   Fuses and other overcurrent protection devices

Buying

Revised

Language in which you want to receive the document.

Scope

Applies to thermal-links, intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. May be applicable to thermal-links for use under other than indoor conditions, provided that the climatic and other circum- stances in the immediate surroundings of such thermal-links are comparable with those in this standard.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60691:1980 ED1

NOW

WITHDRAWN
IEC 60691:1993 ED2
99.60 Withdrawal effective
Dec 19, 2002

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60691:1993/AMD1:1995 ED2

WITHDRAWN
IEC 60691:1993/AMD2:2000 ED2

REVISED BY

WITHDRAWN
IEC 60691:2002 ED3