IEC 61760-1:2020 ED3

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Publication date:   Jul 14, 2020

General information

60.60 Standard published   Jul 14, 2020

IEC

TC 91 Electronics assembly technology

International Standard

31.240   Mechanical structures for electronic equipment

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Scope

IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses.
This edition includes the following significant technical changes with respect to the previous edition:
a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.

Life cycle

PREVIOUSLY

Revises
IEC 61760-1:2006 ED2

NOW

PUBLISHED
IEC 61760-1:2020 ED3
60.60 Standard published
Jul 14, 2020