IEC 60191-2/FRAG4 ED2

32 and 48 pins P-FBGA (Plastic Fine pitch Ball Grid Array), 0,8 mm pitch (Intended for inclusion into IEC 191-2)

Current stage: 10.98 New project rejected May 12, 2000

Originator: IEC

Owner: TC 47/SC 47D Semiconductor devices packaging

Type: International Standard

ABANDON
IEC 60191-2/FRAG4 ED2
10.98 New project rejected
May 12, 2000