IEC 60191-6-3:2000 ED1

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Publication date:   Sep 29, 2000

General information

60.60 Standard published   Sep 29, 2000

IEC

TC 47/SC 47D Semiconductor devices packaging

International Standard

31.080.01   Semiconductor devices in general

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Scope

IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.

Life cycle

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PUBLISHED
IEC 60191-6-3:2000 ED1
60.60 Standard published
Sep 29, 2000