IEC 60127-4:2005 ED3

Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types

Publication date:   Dec 7, 2012

General information

60.60 Standard published   Jan 27, 2005

IEC

TC 32/SC 32C

International Standard

29.120.50   Fuses and other overcurrent protection devices

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Scope

This part of IEC 60127 relates to universal modular fuse-links (UMF) for printed circuits and other substrate systems, used for the protection of electric appliances, electronic equipment, and component parts thereof, normally intended to be used indoors. It does not apply to fuse-links for appliances intended to be used under special conditions, such as in a corrosive or explosive atmosphere. This standard applies in addition to the requirements of IEC 60127-1.

Life cycle

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PUBLISHED
IEC 60127-4:2005 ED3
60.60 Standard published
Jan 27, 2005

CORRIGENDA / AMENDMENTS

Amended by
IEC 60127-4:2005/AMD1:2008 ED3

Amended by
IEC 60127-4:2005/AMD2:2012 ED3