IEC 62326-4:1996 ED1

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

Publication date:   Dec 19, 1996

General information

60.60 Standard published   Dec 19, 1996

IEC

TC 91 Electronics assembly technology

International Standard

31.180   Printed circuits and boards

Buying

Published

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Scope

Applicable to rigid multilayer printed boards irrespective of their
method of manufacture. It is the basis on which agreements between
manufacturer and user are to be made.

Provides additional information necessary to supplement the
requirements of the Generic Specification, IEC 62326-1, for the
printed boards intended to be accepted under the IECQ system.

Establishes uniform requirements, specifies the characteristics to
be assessed and the test methods to be used for quality
conformance.

Life cycle

NOW

PUBLISHED
IEC 62326-4:1996 ED1
60.60 Standard published
Dec 19, 1996