IEC 61249-3-4:1999 ED1

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

Publication date:   Feb 10, 1999

General information

60.60 Standard published   Feb 10, 1999

IEC

TC 91 Electronics assembly technology

International Standard

31.180   Printed circuits and boards

Buying

Published

Language in which you want to receive the document.

Scope

Gives requirements for flexible polyimide films coated on one side or both sides with acrylic or epoxide type adhesive for use in the fabrication of flexible printed wiring.

Films coated on only one side are used as a coverlay or covercoat in the fabrication of flexible printed wiring. This coverlay or covercoat is also used to provide local support to areas subjected to mechanical or environmental stress.

Films coated on both sides are used as bonding films in the fabrication of printed boards.

Life cycle

NOW

PUBLISHED
IEC 61249-3-4:1999 ED1
60.60 Standard published
Feb 10, 1999