IEC 61760-2:2007 ED2

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Publication date:   Apr 24, 2007

General information

99.60 Withdrawal effective   Jul 16, 2021

WPUB   

IEC

TC 91 Electronics assembly technology

International Standard

31.240   Mechanical structures for electronic equipment

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Scope

IEC 61760-2:2007 describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The standard was updated and editorially revised.

Life cycle

PREVIOUSLY

Revises
IEC 61760-2:1998 ED1

NOW

WITHDRAWN
IEC 61760-2:2007 ED2
99.60 Withdrawal effective
Jul 16, 2021

REVISED BY

PUBLISHED
IEC 61760-2:2021 ED3