IEC 60749-4:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) IEC 60749-4:2002/COR1:2003 ED1

General information

99.60 Withdrawal effective   Mar 3, 2017

WPUB   

IEC

TC 47

International Standard

31.080.01   Semiconductor devices in general

Scope

Modification of the validity date: now put at 2007.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749-4:2002 ED1

NOW

WITHDRAWN
IEC 60749-4:2002/COR1:2003 ED1
99.60 Withdrawal effective
Mar 3, 2017

REVISED BY

PUBLISHED
IEC 60749-4:2017 ED2