IEC 60749-39:2006 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Publication date:   Jul 24, 2006

General information

99.60 Withdrawal effective   Nov 29, 2021

WPUB   

IEC

TC 47 Semiconductor devices

International Standard

31.080.01   Semiconductor devices in general

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Revised

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Scope

Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components.
These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.

Life cycle

PREVIOUSLY

Replaces
IEC PAS 62307:2002 ED1

NOW

WITHDRAWN
IEC 60749-39:2006 ED1
99.60 Withdrawal effective
Nov 29, 2021

REVISED BY

PUBLISHED
IEC 60749-39:2021 ED2